Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854933 | Thermally conductive wafer layer | Benjamin Stassen Cook, Archana Venugopal, Daniel Lee Revier | 2023-12-26 |
| 11848258 | Semiconductor package with nickel-silver pre-plated leadframe | Bernardo Gallegos | 2023-12-19 |
| 11694947 | Multi-pitch leads | Sreenivasan K. Koduri | 2023-07-04 |
| 11594504 | Nickel alloy for semiconductor packaging | Christopher Daniel Manack, Salvatore Frank Pavone | 2023-02-28 |
| 11587858 | Zinc-cobalt barrier for interface in solder bond applications | Christopher Daniel Manack, Salvatore Frank Pavone | 2023-02-21 |