Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855024 | Wafer chip scale packages with visible solder fillets | Qiao Chen, Vivek Swaminathan Sridharan, Christopher Daniel Manack, Patrick Francis Thompson, Jonathan Andrew Montoya | 2023-12-26 |
| 11594504 | Nickel alloy for semiconductor packaging | Nazila Dadvand, Christopher Daniel Manack | 2023-02-28 |
| 11587858 | Zinc-cobalt barrier for interface in solder bond applications | Nazila Dadvand, Christopher Daniel Manack | 2023-02-21 |