Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855024 | Wafer chip scale packages with visible solder fillets | Qiao Chen, Vivek Swaminathan Sridharan, Christopher Daniel Manack, Patrick Francis Thompson, Salvatore Frank Pavone | 2023-12-26 |