Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854922 | Semicondutor package substrate with die cavity and redistribution layer | Christopher Daniel Manack, Joseph Liu | 2023-12-26 |
| 11855024 | Wafer chip scale packages with visible solder fillets | Qiao Chen, Christopher Daniel Manack, Patrick Francis Thompson, Jonathan Andrew Montoya, Salvatore Frank Pavone | 2023-12-26 |