Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855024 | Wafer chip scale packages with visible solder fillets | Qiao Chen, Vivek Swaminathan Sridharan, Christopher Daniel Manack, Jonathan Andrew Montoya, Salvatore Frank Pavone | 2023-12-26 |
| 11837518 | Coated semiconductor dies | Michael Todd Wyant, Matthew John Sherbin, Christopher Daniel Manack, You Chye How | 2023-12-05 |
| 11616038 | Interconnect for electronic device | Christopher Daniel Manack, Stefan Herzer, Rakshit Agrawal | 2023-03-28 |
| 11562949 | Semiconductor package including undermounted die with exposed backside metal | Christopher Daniel Manack, Madison Paige Koziol | 2023-01-24 |