Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837518 | Coated semiconductor dies | Matthew John Sherbin, Christopher Daniel Manack, Patrick Francis Thompson, You Chye How | 2023-12-05 |
| 11676829 | Hyperbaric saw for sawing packaged devices | Byron Harry Gibbs | 2023-06-13 |
| 11664276 | Front side laser-based wafer dicing | Matthew John Sherbin, Christopher Daniel Manack, Hiroyuki Sada, Shoichi Iriguchi, Genki Yano +2 more | 2023-05-30 |