Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11854922 | Semicondutor package substrate with die cavity and redistribution layer | Vivek Swaminathan Sridharan, Christopher Daniel Manack | 2023-12-26 | $25,539,000 |
| 11664276 | Front side laser-based wafer dicing | Matthew John Sherbin, Michael Todd Wyant, Christopher Daniel Manack, Hiroyuki Sada, Shoichi Iriguchi +2 more | 2023-05-30 | $73,456,000 |