Issued Patents 2023
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854933 | Thermally conductive wafer layer | Nazila Dadvand, Archana Venugopal, Daniel Lee Revier | 2023-12-26 |
| 11815526 | Aging compensation of a ferroelectric piezoelectric shock sensor | Scott R. Summerfelt | 2023-11-14 |
| 11791296 | Dielectric and metallic nanowire bond layers | Scott R. Summerfelt, Ralf Jakobskrueger Muenster, Sreenivasan K. Koduri | 2023-10-17 |
| 11774519 | Shielded sensor structure and method of making same | Yong Deng, Jo Bito | 2023-10-03 |
| 11728242 | Semiconductor die orifices containing metallic nanowires | Ralf Jakobskrueger Muenster, Sreenivasan K. Koduri | 2023-08-15 |
| 11728111 | Liquid metal MEMS switch | Adam Joseph Fruehling, Dishit Paresh Parekh, Daniel Lee Revier | 2023-08-15 |
| 11714011 | Nanomaterials for attaching mechanical force sensors | Ralf Jakobskrueger Muenster, Sreenivasan K. Koduri | 2023-08-01 |
| 11693235 | Lens cleaning via electrowetting | Daniel Lee Revier, David Patrick Magee, Stephen John Fedigan | 2023-07-04 |
| 11676880 | High thermal conductivity vias by additive processing | Archana Venugopal, Luigi Colombo, Robert Reid Doering | 2023-06-13 |
| 11677156 | Compact high-performance device-integrated antennas | Hassan Ali, Richard Wallace, Swaminathan Sankaran, Sanjay Mohan | 2023-06-13 |
| 11676930 | Nanoparticle backside die adhesion layer | Daniel Lee Revier, Sadia Naseem, Mahmud Halim Chowdhury | 2023-06-13 |
| 11664273 | Adjusting reactive components | Paul Merle Emerson | 2023-05-30 |
| 11607704 | Methods and apparatus for electrostatic control of expelled material for lens cleaners | Daniel Lee Revier, Stephen John Fedigan, David Patrick Magee | 2023-03-21 |
| 11551986 | Shape memory polymer for use in semiconductor device fabrication | Steven Kummerl | 2023-01-10 |
| 11545466 | Multi-die module with contactless coupler and a coupling loss reduction structure | Bichoy Bahr, Baher Haroun | 2023-01-03 |