Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854933 | Thermally conductive wafer layer | Benjamin Stassen Cook, Nazila Dadvand, Daniel Lee Revier | 2023-12-26 |
| 11676880 | High thermal conductivity vias by additive processing | Benjamin Stassen Cook, Luigi Colombo, Robert Reid Doering | 2023-06-13 |