Issued Patents 2023
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11615982 | Reducing spacing between conductive features through implantation | Kuo-Ju Chen, Su-Hao Liu, Liang-Yin Chen, Huicheng Chang, Meng-Han Chou | 2023-03-28 |
| 11605555 | Trench filling through reflowing filling material | Wen-Yen Chen, Li-Ting Wang, Wan-Chen Hsieh, Bo-Cyuan Lu, Tai-Chun Huang +1 more | 2023-03-14 |
| 11605635 | Semiconductor device and method of forming same | Szu-Ying Chen, Sen-Hong Syue, Li-Ting Wang, Huicheng Chang | 2023-03-14 |
| 11600534 | Source/drain structures and method of forming | Wei-Min Liu, Hsueh-Chang Sung, Li-Li Su | 2023-03-07 |
| 11581425 | Method for manufacturing semiconductor structure with enlarged volumes of source-drain regions | Tsung-Hsi Yang, Che-Yu Lin, Yi-Fang Pai, Pei-Ren Jeng, Chii-Horng Li | 2023-02-14 |
| 11575026 | Source/drain structure for semiconductor device | Chien-Wei Lee, Chii-Horng Li, Heng-Wen Ting, Yen-Ru Lee, Chih-Yun Chin +2 more | 2023-02-07 |
| 11569084 | Method for manufacturing semiconductor structure with reduced nodule defects | Che-Yu Lin, Chih-Chiang Chang, Chien-Hung Chen, Ming-Hua Yu, Tsung-Hsi Yang +2 more | 2023-01-31 |
| 11569236 | Replacement gate process for FinFET | Hung-Li Chiang, Cheng-Yi Peng, Tsung-Yao Wen, Yen-Ming Chen | 2023-01-31 |
| 11563110 | Semiconductor structure and method for forming the same | Yi-Yun Li, Tsai-Yu Huang, Huicheng Chang | 2023-01-24 |