WH

Wan-Chen Hsieh

TSMC: 2 patents #1,466 of 4,064Top 40%
Overall (2023): #97,698 of 537,848Top 20%
2
Patents 2023

Issued Patents 2023

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11728173 Masking layer with post treatment Wen-Ju Chen, Chung-Ting Ko, Chun-Ming Lung, Tai-Chun Huang, Chi On Chui 2023-08-15
11605555 Trench filling through reflowing filling material Wen-Yen Chen, Li-Ting Wang, Bo-Cyuan Lu, Tai-Chun Huang, Huicheng Chang +1 more 2023-03-14