Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854963 | Semiconductor interconnection structure and methods of forming the same | Shao-Kuan Lee, Kuang-Wei YANG, Cherng-Shiaw Tsai, Cheng-Chin Lee, Chi-Lin Teng +3 more | 2023-12-26 |
| 11848198 | Method for manufacturing semiconductor device having low-k carbon-containing dielectric layer | Kai-Fang Cheng, Hsiao-Kang Chang | 2023-12-19 |
| 11810815 | Dielectric capping structure overlying a conductive structure to increase stability | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Shau-Lin Shue, Shao-Kuan Lee +1 more | 2023-11-07 |
| 11658092 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Cheng-Chin Lee, Chi-Lin Teng, Kai-Fang Cheng +3 more | 2023-05-23 |
| 11557511 | Semiconductor device structure and methods of forming the same | Hsin-Yen Huang, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Hsiaokang CHANG +1 more | 2023-01-17 |