Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854963 | Semiconductor interconnection structure and methods of forming the same | Shao-Kuan Lee, Kuang-Wei YANG, Cherng-Shiaw Tsai, Cheng-Chin Lee, Ting-Ya Lo +3 more | 2023-12-26 |
| 11830808 | Semiconductor structure and method making the same | Hsin-Yen Huang, Kai-Fang Cheng, Hai-Ching Chen, Tien-I Bao | 2023-11-28 |
| 11810815 | Dielectric capping structure overlying a conductive structure to increase stability | Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue, Shao-Kuan Lee, Cheng-Chin Lee +1 more | 2023-11-07 |
| 11658092 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Ting-Ya Lo, Cheng-Chin Lee, Kai-Fang Cheng +3 more | 2023-05-23 |
| 11557511 | Semiconductor device structure and methods of forming the same | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Cheng-Chin Lee, Hsiaokang CHANG +1 more | 2023-01-17 |