Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855182 | Low-k gate spacer and methods for forming the same | Wen-Kai Lin, Bo-Yu Lai, Li Chun Te, Kai-Hsuan Lee, Sai-Hooi Yeong +1 more | 2023-12-26 |
| 11854820 | Spacer etching process for integrated circuit design | Ru-Gun Liu, Cheng-Hsiung Tsai, Chung-Ju Lee, Chih-Ming Lai, Chia-Ying Lee +6 more | 2023-12-26 |
| 11830808 | Semiconductor structure and method making the same | Hsin-Yen Huang, Kai-Fang Cheng, Chi-Lin Teng, Hai-Ching Chen | 2023-11-28 |
| 11823960 | Method for forming semiconductor structure with high aspect ratio | Han-Pin Chung, Chih-Tang Peng | 2023-11-21 |
| 11791154 | Cyclic spin-on coating process for forming dielectric material | Je-Ming Kuo, Yen-Chun Huang, Chih-Tang Peng | 2023-10-17 |
| 11728271 | Structure and method for a low-K dielectric with pillar-type air-gaps | Chih Wei Lu, Chung-Ju Lee | 2023-08-15 |
| 11658120 | Porogen bonded gap filling material in semiconductor manufacturing | Bo-Jiun Lin, Ching-Yu Chang, Hai-Ching Chen | 2023-05-23 |
| 11637010 | System and method of forming a porous low-k structure | Bo-Jiun Lin, Hai-Ching Chen | 2023-04-25 |
| 11569124 | Interconnect structure having an etch stop layer over conductive lines | Cheng-Hsiung Tsai, Chung-Ju Lee, Shau-Lin Shue | 2023-01-31 |