Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658120 | Porogen bonded gap filling material in semiconductor manufacturing | Ching-Yu Chang, Hai-Ching Chen, Tien-I Bao | 2023-05-23 |
| 11637010 | System and method of forming a porous low-k structure | Hai-Ching Chen, Tien-I Bao | 2023-04-25 |