Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848198 | Method for manufacturing semiconductor device having low-k carbon-containing dielectric layer | Ting-Ya Lo, Hsiao-Kang Chang | 2023-12-19 |
| 11830808 | Semiconductor structure and method making the same | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Tien-I Bao | 2023-11-28 |
| 11658092 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Ting-Ya Lo, Cheng-Chin Lee, Chi-Lin Teng +3 more | 2023-05-23 |