Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854963 | Semiconductor interconnection structure and methods of forming the same | Shao-Kuan Lee, Kuang-Wei YANG, Cherng-Shiaw Tsai, Cheng-Chin Lee, Ting-Ya Lo +3 more | 2023-12-26 |
| 11848198 | Method for manufacturing semiconductor device having low-k carbon-containing dielectric layer | Kai-Fang Cheng, Ting-Ya Lo | 2023-12-19 |
| 11658092 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Ting-Ya Lo, Cheng-Chin Lee, Chi-Lin Teng +3 more | 2023-05-23 |
| 11640928 | Heat dispersion layers for double sided interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Shau-Lin Shue, Cherng-Shiaw Tsai | 2023-05-02 |