Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854963 | Semiconductor interconnection structure and methods of forming the same | Shao-Kuan Lee, Kuang-Wei YANG, Cherng-Shiaw Tsai, Ting-Ya Lo, Chi-Lin Teng +3 more | 2023-12-26 |
| 11810815 | Dielectric capping structure overlying a conductive structure to increase stability | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Shau-Lin Shue, Shao-Kuan Lee +1 more | 2023-11-07 |
| 11769695 | Semiconductor structure including low-resistance interconnect and integrated circuit device having the same | Hsin-Yen Huang, Shao-Kuan Lee, Hsiang-Wei Liu, Tai-I Yang, Chia-Tien Wu +2 more | 2023-09-26 |
| 11756878 | Self-aligned via structure by selective deposition | Shao-Kuan Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue | 2023-09-12 |
| 11658092 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Ting-Ya Lo, Chi-Lin Teng, Kai-Fang Cheng +3 more | 2023-05-23 |
| 11557511 | Semiconductor device structure and methods of forming the same | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Hsiaokang CHANG +1 more | 2023-01-17 |