Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854963 | Semiconductor interconnection structure and methods of forming the same | Shao-Kuan Lee, Kuang-Wei YANG, Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng +3 more | 2023-12-26 |
| 11664237 | Semiconductor device having improved overlay shift tolerance | Chien-Hua Huang, Tzu-Hui Wei | 2023-05-30 |
| 11658092 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Ting-Ya Lo, Cheng-Chin Lee, Chi-Lin Teng, Kai-Fang Cheng +3 more | 2023-05-23 |
| 11640928 | Heat dispersion layers for double sided interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Shau-Lin Shue, Hsiao-Kang Chang | 2023-05-02 |