| 11830856 |
Semiconductor package and related methods |
Erik Nino Tolentino, Vemmond Jeng Hung NG, Shutesh Krishnan |
2023-11-28 |
| 11804421 |
Connecting clip design for pressure sintering |
Atapol Prajuckamol, Yushuang YAO |
2023-10-31 |
| 11791288 |
Reinforced semiconductor die and related methods |
Erik Nino Tolentino, Yusheng LIN, Swee Har KHOR |
2023-10-17 |
| 11710687 |
Semiconductor package with guide pin |
Yushuang YAO, Atapol Prajuckamol, Chuncao NIU |
2023-07-25 |
| 11672087 |
Semiconductor package |
Atapol Prajuckamol, Yushuang YAO |
2023-06-06 |
| 11569140 |
Semiconductor package with elastic coupler and related methods |
Yusheng LIN, Francis J. Carney |
2023-01-31 |
| 11562938 |
Spacer with pattern layout for dual side cooling power module |
Yong Liu, Liangbiao CHEN, Yusheng LIN |
2023-01-24 |
| 11557530 |
Semiconductor devices and methods of making the same |
Swee Har KHOR, Tian Hing Lim, Hui Min LER, Phillip Celaya |
2023-01-17 |