Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810775 | High power module package structures | Jerome Teysseyre | 2023-11-07 |
| 11791288 | Reinforced semiconductor die and related methods | Chee Hiong CHEW, Erik Nino Tolentino, Swee Har KHOR | 2023-10-17 |
| 11742381 | Monolithic semiconductor device assemblies | Peter Moens, Gordon M. Grivna | 2023-08-29 |
| 11728424 | Isolation in a semiconductor device | Takashi Noma, Kazuo Okada, Hideaki Yoshimi, Shunsuke YASUDA | 2023-08-15 |
| 11646267 | Thinned semiconductor package and related methods | Takashi Noma, Francis J. Carney | 2023-05-09 |
| 11594510 | Assembly processes for semiconductor device assemblies including spacer with embedded semiconductor die | Yong Liu, Huibin Chen | 2023-02-28 |
| 11569140 | Semiconductor package with elastic coupler and related methods | Chee Hiong CHEW, Francis J. Carney | 2023-01-31 |
| 11562938 | Spacer with pattern layout for dual side cooling power module | Yong Liu, Liangbiao CHEN, Chee Hiong CHEW | 2023-01-24 |