Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854995 | Supports for thinned semiconductor substrates and related methods | Michael J. Seddon | 2023-12-26 |
| 11830756 | Temporary die support structures and related methods | Michael J. Seddon | 2023-11-28 |
| 11776870 | Direct bonded copper substrates fabricated using silver sintering | Erik Nino Tolentino, Shutesh Krishnan | 2023-10-03 |
| 11710691 | Semiconductor device and method of forming micro interconnect structures | Jefferson W. Hall, Michael J. Seddon | 2023-07-25 |
| 11646267 | Thinned semiconductor package and related methods | Yusheng LIN, Takashi Noma | 2023-05-09 |
| 11616008 | Through-substrate via structure and method of manufacture | Michael J. Seddon | 2023-03-28 |
| 11569140 | Semiconductor package with elastic coupler and related methods | Yusheng LIN, Chee Hiong CHEW | 2023-01-31 |