Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830856 | Semiconductor package and related methods | Chee Hiong CHEW, Vemmond Jeng Hung NG, Shutesh Krishnan | 2023-11-28 |
| 11791288 | Reinforced semiconductor die and related methods | Chee Hiong CHEW, Yusheng LIN, Swee Har KHOR | 2023-10-17 |
| 11776870 | Direct bonded copper substrates fabricated using silver sintering | Shutesh Krishnan, Francis J. Carney | 2023-10-03 |
| 11626677 | Bonding module pins to an electronic substrate | Dennis Cadiz YBORDE, Shutesh Krishnan, Pui Leng LOW | 2023-04-11 |