Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830856 | Semiconductor package and related methods | Chee Hiong CHEW, Erik Nino Tolentino, Shutesh Krishnan | 2023-11-28 |
| 11735504 | Power module package baseplate with step recess design | Yushuang YAO | 2023-08-22 |