Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804421 | Connecting clip design for pressure sintering | Atapol Prajuckamol, Chee Hiong CHEW | 2023-10-31 |
| 11735504 | Power module package baseplate with step recess design | Vemmond Jeng Hung NG | 2023-08-22 |
| 11710687 | Semiconductor package with guide pin | Chee Hiong CHEW, Atapol Prajuckamol, Chuncao NIU | 2023-07-25 |
| 11672087 | Semiconductor package | Atapol Prajuckamol, Chee Hiong CHEW | 2023-06-06 |