Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804421 | Connecting clip design for pressure sintering | Chee Hiong CHEW, Yushuang YAO | 2023-10-31 |
| 11710687 | Semiconductor package with guide pin | Chee Hiong CHEW, Yushuang YAO, Chuncao NIU | 2023-07-25 |
| 11672087 | Semiconductor package | Yushuang YAO, Chee Hiong CHEW | 2023-06-06 |