Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830856 | Semiconductor package and related methods | Chee Hiong CHEW, Erik Nino Tolentino, Vemmond Jeng Hung NG | 2023-11-28 |
| 11776870 | Direct bonded copper substrates fabricated using silver sintering | Erik Nino Tolentino, Francis J. Carney | 2023-10-03 |
| 11721654 | Ultra-thin multichip power devices | Nurul Nadiah Manap, Soon Wei WANG | 2023-08-08 |
| 11626677 | Bonding module pins to an electronic substrate | Erik Nino Tolentino, Dennis Cadiz YBORDE, Pui Leng LOW | 2023-04-11 |