Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735497 | Integrated passive device and fabrication method using a last through-substrate via | Hideyuki Inotsume, Kazuo Okada | 2023-08-22 |
| 11728424 | Isolation in a semiconductor device | Yusheng LIN, Kazuo Okada, Hideaki Yoshimi, Shunsuke YASUDA | 2023-08-15 |
| 11676863 | Structures for aligning a semiconductor wafer for singulation | Michael J. Seddon | 2023-06-13 |
| 11646267 | Thinned semiconductor package and related methods | Yusheng LIN, Francis J. Carney | 2023-05-09 |