Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848320 | Power module package for direct cooling multiple power modules | Inpil Yoo, Jooyang EOM | 2023-12-19 |
| 11810775 | High power module package structures | Yusheng LIN | 2023-11-07 |
| 11735508 | Vertical and horizontal circuit assemblies | Romel N. Manatad, Chung-Lin Wu, Bigildis Dosdos, Erwin Ian V. Almagro, Maria Cristina Estacio | 2023-08-22 |
| 11621203 | SiC MOSFET semiconductor packages and related methods | Maria Cristina Estacio, Elsie Agdon Cabahug | 2023-04-04 |
| 11616006 | Semiconductor package with heatsink | Maria Clemens Y. Quinones, Elsie Agdon Cabahug | 2023-03-28 |
| 11610832 | Heat transfer for power modules | Roveendra PAUL, Dukyong LEE | 2023-03-21 |
| 11545421 | Package including multiple semiconductor devices | Maria Cristina Estacio, Seungwon IM | 2023-01-03 |