Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658171 | Dual cool power module with stress buffer layer | Jonghwan BAEK, Jeonghyuk Park, Keunhyuk LEE | 2023-05-23 |
| 11652030 | Power module and related methods | Jonghwan BAEK, Jeonghyuk Park, Keunhyuk LEE | 2023-05-16 |
| 11615967 | Power module package and method of manufacturing the same | Keunhyuk LEE, Oseob Jeon, Joonseo SON | 2023-03-28 |
| 11545421 | Package including multiple semiconductor devices | Jerome Teysseyre, Maria Cristina Estacio | 2023-01-03 |