Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11615967 | Power module package and method of manufacturing the same | Keunhyuk LEE, Oseob Jeon, Seungwon IM | 2023-03-28 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11615967 | Power module package and method of manufacturing the same | Keunhyuk LEE, Oseob Jeon, Seungwon IM | 2023-03-28 |