Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776871 | Module with substrate recess for conductive-bonding component | Leo GU, Sixin JI, Jie Chang, Yong Liu | 2023-10-03 |
| 11658171 | Dual cool power module with stress buffer layer | Jonghwan BAEK, Jeonghyuk Park, Seungwon IM | 2023-05-23 |
| 11652030 | Power module and related methods | Jonghwan BAEK, Jeonghyuk Park, Seungwon IM | 2023-05-16 |
| 11615967 | Power module package and method of manufacturing the same | Oseob Jeon, Joonseo SON, Seungwon IM | 2023-03-28 |