Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776871 | Module with substrate recess for conductive-bonding component | Sixin JI, Jie Chang, Keunhyuk LEE, Yong Liu | 2023-10-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776871 | Module with substrate recess for conductive-bonding component | Sixin JI, Jie Chang, Keunhyuk LEE, Yong Liu | 2023-10-03 |