Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842942 | Structure and method related to a power module using a hybrid spacer | Liangbiao CHEN, Tzu-Hsuan Cheng, Stephen St. Germain, Roger M. Arbuthnot | 2023-12-12 |
| 11830784 | Leadframe spacer for double-sided power module | Tzu-Hsuan Cheng, Liangbiao CHEN | 2023-11-28 |
| D1004172 | Lamp | — | 2023-11-07 |
| 11776871 | Module with substrate recess for conductive-bonding component | Leo GU, Sixin JI, Jie Chang, Keunhyuk LEE | 2023-10-03 |
| 11646249 | Dual-side cooling semiconductor packages and related methods | Qing Yang | 2023-05-09 |
| D980163 | Wireless charger | — | 2023-03-07 |
| 11594510 | Assembly processes for semiconductor device assemblies including spacer with embedded semiconductor die | Yusheng LIN, Huibin Chen | 2023-02-28 |
| 11562938 | Spacer with pattern layout for dual side cooling power module | Liangbiao CHEN, Yusheng LIN, Chee Hiong CHEW | 2023-01-24 |
| D975346 | Moon lamp set | — | 2023-01-10 |