Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842942 | Structure and method related to a power module using a hybrid spacer | Liangbiao CHEN, Yong Liu, Tzu-Hsuan Cheng, Roger M. Arbuthnot | 2023-12-12 |
| 11710686 | Semiconductor package structures and methods of manufacture | Jay A. Yoder, Dennis Lee Conner, Frank Robert Cervantes, Andrew Celaya | 2023-07-25 |