Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658171 | Dual cool power module with stress buffer layer | Jeonghyuk Park, Seungwon IM, Keunhyuk LEE | 2023-05-23 |
| 11652030 | Power module and related methods | Jeonghyuk Park, Seungwon IM, Keunhyuk LEE | 2023-05-16 |