Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658171 | Dual cool power module with stress buffer layer | Jonghwan BAEK, Seungwon IM, Keunhyuk LEE | 2023-05-23 |
| 11652030 | Power module and related methods | Jonghwan BAEK, Seungwon IM, Keunhyuk LEE | 2023-05-16 |