Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11852984 | Target debris collection device and extreme ultraviolet light source apparatus including the same | Ho YU, Jeonggil Kim, Minseok Choi | 2023-12-26 |
| 11848301 | Method of manufacturing a semiconductor package | Jonggu LEE, Byungjo KIM, Sanghoon Lee, Sukwon Lee, Sebin Choi | 2023-12-19 |
| 11837573 | Chip bonding apparatus and method of manufacturing semiconductor device using the apparatus | Junhyung Kim, Joongha Lee, Sangha Park, Kyeongbin Lim | 2023-12-05 |
| 11720027 | Apparatus for generating extreme ultraviolet light and lithography apparatus including the same | Injae Lee, Ohkug Kwon, Yongchan Kim, Ouiserg Kim, Jeonggil Kim +4 more | 2023-08-08 |
| 11711883 | Droplet accelerating assembly and extreme ultra-violet lithography apparatus including the same | Minseok Choi, Injae Lee, Inho Choi, Sungyeol Kim, Jeonggil Kim +1 more | 2023-07-25 |
| 11698590 | Collector mirror and apparatus for creating extreme ultraviolet light including the same | Hoseok Song, Injae Lee, Jeonggil Kim | 2023-07-11 |
| 11626381 | Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same | Jonggu LEE, Byungjo KIM, Sanghoon Lee, Sukwon Lee, Sebin Choi | 2023-04-11 |
| 11607741 | Semiconductor chip bonding apparatus including head having thermally conductive materials | Sebin Choi, Sukwon Lee, Jonggu LEE | 2023-03-21 |
| 11599031 | Target debris collection device and extreme ultraviolet light source apparatus including the same | Ho YU, Jeonggil Kim, Minseok Choi | 2023-03-07 |