Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848301 | Method of manufacturing a semiconductor package | Jonggu LEE, Sunghyup Kim, Sanghoon Lee, Sukwon Lee, Sebin Choi | 2023-12-19 |
| 11626381 | Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same | Jonggu LEE, Sunghyup Kim, Sanghoon Lee, Sukwon Lee, Sebin Choi | 2023-04-11 |
| 11545344 | Upper electrode and substrate processing apparatus including the same | Sangki Nam, Jungmin Ko, Kwonsang Seo, Seungbo Shim, Younghyun JO | 2023-01-03 |