Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848301 | Method of manufacturing a semiconductor package | Jonggu LEE, Sunghyup Kim, Byungjo KIM, Sanghoon Lee, Sukwon Lee | 2023-12-19 |
| 11626381 | Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same | Jonggu LEE, Sunghyup Kim, Byungjo KIM, Sanghoon Lee, Sukwon Lee | 2023-04-11 |
| 11607741 | Semiconductor chip bonding apparatus including head having thermally conductive materials | Sunghyup Kim, Sukwon Lee, Jonggu LEE | 2023-03-21 |