Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837573 | Chip bonding apparatus and method of manufacturing semiconductor device using the apparatus | Junhyung Kim, Joongha Lee, Sangha Park, Sunghyup Kim | 2023-12-05 |
| 11581188 | Substrate bonding apparatus | Junhyung Kim, Minsoo Han, Minwoo Rhee, Inbae Chang | 2023-02-14 |