Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848203 | Methods of processing substrate and manufacturing semiconductor device by forming film, substrate processing apparatus, and recording medium | Takayuki Waseda, Takashi Nakagawa, Kimihiko NAKATANI, Motomu DEGAI, Takao Izaki | 2023-12-19 |
| 11823886 | Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium | Kazuhiro Harada, Masayoshi Minami, Shintaro Kogura, Shogo Otani | 2023-11-21 |
| 11817314 | Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium | Katsuyoshi Harada, Tatsuru Matsuoka | 2023-11-14 |
| 11728165 | Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor device | Hiroki Yamashita | 2023-08-15 |
| 11699593 | Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium | Kimihiko NAKATANI, Ryota Ueno, Motomu DEGAI, Takashi Nakagawa, Yoshiro Hirose | 2023-07-11 |
| 11664217 | Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium | Katsuyoshi Harada, Tatsuru Matsuoka | 2023-05-30 |
| 11626280 | Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium | Kimihiko NAKATANI, Takayuki Waseda | 2023-04-11 |