Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848203 | Methods of processing substrate and manufacturing semiconductor device by forming film, substrate processing apparatus, and recording medium | Takayuki Waseda, Takashi Nakagawa, Motomu DEGAI, Takao Izaki, Yoshitomo HASHIMOTO | 2023-12-19 |
| 11837466 | Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium | — | 2023-12-05 |
| 11746416 | Method of processing substrate and manufacturing semiconductor device by forming film containing silicon | — | 2023-09-05 |
| 11705326 | Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium | Hiroshi Ashihara, Motomu DEGAI, Kenji Kameda | 2023-07-18 |
| 11699593 | Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium | Ryota Ueno, Motomu DEGAI, Takashi Nakagawa, Yoshitomo HASHIMOTO, Yoshiro Hirose | 2023-07-11 |
| 11626280 | Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium | Yoshitomo HASHIMOTO, Takayuki Waseda | 2023-04-11 |