Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848203 | Methods of processing substrate and manufacturing semiconductor device by forming film, substrate processing apparatus, and recording medium | Takayuki Waseda, Takashi Nakagawa, Kimihiko NAKATANI, Motomu DEGAI, Yoshitomo HASHIMOTO | 2023-12-19 |