Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735412 | Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium | Atsushi Sano, Yushin Takasawa | 2023-08-22 |
| 11705326 | Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium | Kimihiko NAKATANI, Hiroshi Ashihara, Motomu DEGAI | 2023-07-18 |
| 11616334 | Method of manufacturing cable assembly, horn chip used in the method and cable assembly manufactured by the method | Masayuki Shiratori | 2023-03-28 |