Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715703 | EMI shielding for flip chip package with exposed die backside | SungWon Cho, ChangOh Kim, Il Kwon Shim, InSang Yoon | 2023-08-01 |
| 11688697 | Emi shielding for flip chip package with exposed die backside | Dong Won Son, ByeongHoon Kim, Sung-Ho Choi, Sung Jae Lim, Jong-Ho Shin +2 more | 2023-06-27 |
| 11664327 | Selective EMI shielding using preformed mask | HunTeak Lee, Kyunghwan KIM, HeeSoo Lee, ChangOh Kim, JinHee Jung +3 more | 2023-05-30 |
| 11616025 | Selective EMI shielding using preformed mask with fang design | ChangOh Kim, JinHee Jung, OMin Kwon, Jiwon Lee, YuJeong Jang | 2023-03-28 |
| 11610847 | Laser-based redistribution and multi-stacked packages | ChangOh Kim, Seonghwan Park, JinHee Jung | 2023-03-21 |
| 11594438 | Semiconductor manufacturing device to securely hold semiconductor panels for transport and manufacturing processes | HyeonChul LEE, Kyunghwan KIM | 2023-02-28 |