DS

Dong Won Son

SC Stats Chippac: 1 patents #24 of 53Top 50%
📍 Seoul, KR: #3,051 of 7,884 inventorsTop 40%
Overall (2023): #459,969 of 537,848Top 90%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11688697 Emi shielding for flip chip package with exposed die backside ByeongHoon Kim, Sung-Ho Choi, Sung Jae Lim, Jong-Ho Shin, SungWon Cho +2 more 2023-06-27