Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11840588 | Polyolefin resin and preparation method thereof | Hee Jun Lee, Byung Keel Sohn, Da Jung Kim, Su Hyun Park | 2023-12-12 |
| 11817465 | Image sensors | Jung Bin Yun, Eun Sub Shim, Kyung Ho Lee, Jung-Hoon Park, Jung Wook Lim +1 more | 2023-11-14 |
| 11729524 | Depth sensor and method of operating the same | Younggu Jin, Youngchan Kim | 2023-08-15 |
| 11688697 | Emi shielding for flip chip package with exposed die backside | Dong Won Son, ByeongHoon Kim, Sung Jae Lim, Jong-Ho Shin, SungWon Cho +2 more | 2023-06-27 |
| 11681701 | Systems and methods for reducing database query latency | Seong Jin Kim | 2023-06-20 |
| 11680160 | Polyolefin resin composition and production method of same | Jang-woo Lee, Byung Keel Sohn, Sah-Mun Hong, Da Jung Kim, Hee Jun Lee +1 more | 2023-06-20 |
| 11633923 | Apparatus and method for applying adhesive | — | 2023-04-25 |
| 11581344 | Image sensors | Jung Bin Yun, Eun Sub Shim, Kyung Ho Lee, Jung-Hoon Park, Jung Wook Lim +1 more | 2023-02-14 |
| RE49357 | IMS reregistration method and system therefor | Han Na Lim, Tae Sun Yeoum, Eun-Hui Bae, O-Sok Song | 2023-01-03 |