Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715653 | Substrate processing apparatus | Byunghwan Kong, Seungyong Bae, Jaehyun An | 2023-08-01 |
| 11688697 | Emi shielding for flip chip package with exposed die backside | Dong Won Son, Sung-Ho Choi, Sung Jae Lim, Jong-Ho Shin, SungWon Cho +2 more | 2023-06-27 |