Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688697 | Emi shielding for flip chip package with exposed die backside | Dong Won Son, ByeongHoon Kim, Sung-Ho Choi, Sung Jae Lim, SungWon Cho +2 more | 2023-06-27 |
| 11605305 | Method, system, and computer-readable recording medium for providing education service based on knowledge units | Yong Jae Kim, Seo Joon Kim, Seung Yun Cho | 2023-03-14 |